Package: kmod-hwmon-w83793
Version: 4.14.131-1
Depends: kernel (=4.14.131-1-a713877cd5be25b06e3414788bf8eaba), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
License: GPL-2.0
Section: kernel
Architecture: arm_fa526
Installed-Size: 13983
Description:  Kernel module for the Winbond W83793G and W83793R chips.
